キーワード: T3, E3, STS-1, Line Interface Units, LIU, Layout. 関連製品
アプリケーションノート3410
Guidelines for Laying Out T3 and E3 Network Interfaces
Dec 22, 2004
Abstract: This application note shows how to maintain the proper impedances when laying out a circuit board with a T3/E3 networking interface, using the DS315x LIU products.
Overview
This application note is a guideline on how to layout the network interface for Dallas Semiconductor T3/E3 line interface units (LIUs). The guideline uses the DS315x products as examples. This application note is also applicable for other Dallas Semiconductor T3/E3 products.
The DS315x products include the DS3151 (single), DS3152 (dual), DS3153 (triple), and DS3154 (quad) LIUs which perform the necessary functions for interfacing at the physical layer to a DS3, E3, or STS-1 line. Each LIU has independent receive and transmit paths.
Each layout shows the communication line routing between the DS315x LIU, the transformer, and the 75Ω BNC connectors. In particular, each layout defines the recommended trace widths to ensure the proper impedance for a given network interface. All board stack-ups are the same.
Board Stackup
Below is an example of the trace-width calculation for a T3/E3 LIU interface.
Surface Materials
Thickness
Dielectric Constant
Line Widths
Impedance
TX, RX @ 75Ω
Top conductor copper
1.2MIL
N/A
25MIL
75Ω
Dielectric FR-4
21.57MIL
4.5
N/A
N/A
L2_GND conductor copper
0.7MIL
N/A
N/A
N/A
TXP, TXN, RXP, RXN @ 150Ω
Bottom conductor copper
1.2MIL
N/A
5MIL
150Ω
Dielectric FR-4
61.53MIL
4.5
N/A
N/A
L2_GND conductor copper
0.7MIL
N/A
N/A
N/A
Note: The impedance was calculated with Cadence® Allegro.
Basic Network Interface
Layout Considerations
Impedance
Location—keep termination resistors as close to the LIU as possible.
Trace widths—keep trace widths as short as possible.
Do not route the GND plane under the transformer to reduce noise.
Do not route the VCC plane under the transformer or TXP, TXN, RXP, RXN routes.