キーワード: calculating pad coordinates, die dimensions, die orientation, bonding coordinates, calculating die size, physical die size 関連製品
アプリケーションノート630
HFAN-08.0.1: Understanding Bonding Coordinates and Physical Die Size
Aug 06, 2001
Abstract: When calculating pad coordinates, there is often confusion between die size specified in the data sheet and the physical die size after it is cut from the wafer. The physical edge of the die is not a good reference for wire bonding because of slight inconsistencies of overall die dimensions. This application note will briefly discuss die dimensions, die orientation, bonding coordinates, and how to calculate the physical die size. The MAX3970 will be used as an example.
アプリケーションノート630：HFAN-08.0.1: Understanding Bonding Coordinates and Physical Die Size