材料成分分析データファイル

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	鉛フリー/RoHS製品および成分データの検索
	鉛フリー/RoHS製品のお知らせおよび注文について
	鉛フリー/RoHSの概要
	鉛フリー/RoHSに関するFAQ
	錫ウィスカデータ
	有害物質規制(RoHS)情報

	有鉛情報
	Sn/Ag/Cu半田の材料特性におけるPb汚染効果
	リフロー耐湿性レベル(MSL)
	化学情報検索サービス機関(CAS)番号
	含有量計算方法
	材料安全性データシート(MSDS)
	材料成分分析データファイル

	ISO 14001/環境管理システム
	環境管理システムの証明書



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	マキシム > EMMI > 材料成分分析データファイル

	材料成分分析データファイル梱包材料梱包材料品目フリップチップデバイスの材料成分分析データ Flip_Chip_Backside_Lamination_Lintec_LC2850_13-MAY-2005 (PDF, 447kB) スパッタリングターゲットの材料成分分析データ Sputtering_Targets_Copper_03-JULY-2007 (PDF, 122kB) Sputtering_Targets_for_UBM (PDF, 50kB) Sputtering_Targets_TITANIUM_4SUBS_09-28-2007 (PDF, 205kB) WLP_Sputtering_Targets_and_Sn_Pb_Plating_Anodes_10-15-06 (PDF, 128kB) BCB樹脂の材料成分分析データ BCB_CYCLOTENE_4024-40_DATASHEET (PDF, 20kB) BCB_EPOXY-4024_6SUBS_08-23-07 (PDF, 196kB) BCB_Resin_PBB_PBDE (PDF, 90kB) BCB_Resin_Pb_Cr+6_Hg_Cd (PDF, 42kB) 捺印インクの材料成分分析データ BRANDING_INK_INK_TYPE_B (PDF, 129kB) INK_BONMARQUE_C-SERIES-Ag_UV-WHITE_UV-BLACK_UV4-BLACK_UV-Ag_CdPb&USE-NONUSE-SUBS_03-12-2007 (PDF, 978kB) INK_MARKEM-7224-BLACK-65-A_TR6SUBS_11-20-2007 (PDF, 14kB) INK_MARKEM_13TYPES_SDOC-NON-USE_PFOS_04-10-2008 (PDF, 96kB) INK_MARKEM_4461-BLACK_TR6SUBS_12-24-2004 (PDF, 111kB) INK_MARKEM_4466-WHITE_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_4488-BLACK&WHITE_SDOC-NON-USE_PFOS+_02-13-2008 (PDF, 48kB) INK_MARKEM_4496-WHITE_TR6SUBS_11-20-2007 (PDF, 14kB) INK_MARKEM_7224-GREYF_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_7261-BLACK_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_7281-BLACK_TR6SUBS_03-27-2008 (PDF, 44kB) INK_MARKEM_7281-GREY479J_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_7281-GREY479J_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_9060-WHITE&7281-BLACK_SDOC-CONTENT_6SUBS_03-21-2008 (PDF, 40kB) INK_MARKEM_9060-WHITE-EXH_TR6SUBS_03-21-2008 (PDF, 14kB) INK_MARKEM_9060-WHITE_TR6SUBS_03-27-2008 (PDF, 44kB) INK_OSE-APPLIED-INNOTECH_M238_6SUBS_06-18-2007 (PDF, 60kB) ICリードフレーム部品の材料成分分析データ ASM (FOR ISPL) COPPER A194 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 28, 2008 KA/2008/10990A-01R2 SGS (PDF, 524kB) DYNACRAFT (FOR CARSEM) COPPER C194 WITH SPOT SILVER PLATE "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 31, 2008 LPCI/24550/07 SGS (PDF, 224kB) LEADFRAMES_AMKOR-ACQUTEK_5TYPES_SDOC-NON-USE_8SUBS_03-03-2008 (PDF, 110kB) LEADFRAMES_AMKOR-LGMICRON_SDOC-NON-USE_PFOS_11-13-2007 (PDF, 325kB) LEADFRAMES_AMKOR-POONGSAN_C914R-MULTITYPES_SDOC-NON-USE_PFOS+_02-04-2008 (PDF, 22kB) Leadframes_AMKOR-POSSEHL_SPOT-Ag-A194_SDOC-NON-USE_PFOS+_01-16-2008 (PDF, 37kB) LEADFRAMES_AMKOR-QPL_SDOC-NON-USE_PFOS+_01-15-2008 (PDF, 161kB) LEADFRAMES_AMKOR-SAMSUNG-TECHWIN_C194-SPOTAg_TR9SUBS_02-25-2008 (PDF, 106kB) LEADFRAMES_AMKOR-SHINKO_16PDIP_SDOC-NON-USE_PFOS_PFAS_02-12-2008 (PDF, 27kB) LEADFRAMES_AMKOR-SUMIKO_SDOC-NON-USE_PFOS+_01-31-2008 (PDF, 29kB) Leadframes_Amkor_EFTEC64T (PDF, 156kB) Leadframes_ASAT-QPL_ALL-TYPES_SDOC-NON-USE_PFOS_08-11-2007 (PDF, 75kB) Leadframes_ASM_SDOC_8SUBS-NON-USE_01-10-2008 (PDF, 479kB) Leadframes_ASM_Technology_A194_1-29-07 (PDF, 144kB) Leadframes_CARSEM-DYNACRAFT_16TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 1200kB) LEADFRAMES_CARSEM-DYNACRAFT_ALLOY42-SPOTAg-TYPES_6SUBS_01-30-2008 (PDF, 145kB) LEADFRAMES_CARSEM-DYNACRAFT_TR44SUBS_08-31-2007 (PDF, 540kB) Leadframes_Dynacraft_Industries_C104_Ag_Spot_31-JAN-2007 (PDF, 272kB) Leadframes_Dynacraft_Industries_C151_C7025_C194_Alloy 42 (PDF, 179kB) Leadframes_Dynacraft_SDOC-NON-USE_TBBPA_16-LEADFRAME-TYPES_12-10-2007 (PDF, 45kB) LEADFRAMES_HANA-ASM_CuA194_TR6SUBS_01-28-2008 (PDF, 975kB) LEADFRAMES_HANA-JADE_CuC194-AgSPOT_TR6SUBS_01-18-2008 (PDF, 249kB) Leadframes_HANA-JADE_SDOC-NON-USE-8SUBS_01-16-2008 (PDF, 19kB) LEADFRAMES_HANA-MITSUHITEC_CuA194-AgPLATE_TR6SUBS_03-12-2007 (PDF, 89kB) LEADFRAMES_HANA-QPL_Cu194-AgPLATE_TR6SUBS_04-02-2007 (PDF, 221kB) Leadframes_Hana_BT_Substrates_ML_HL_GMPL_and_GHPL_Series (PDF, 615kB) LEADFRAMES_ISPL-ASM_ALL-TYPES_SDOC-NON-USE_6SUBS_01-31-2007 (PDF, 244kB) LEADFRAMES_ISPL-ASM_CuA194-AgPLATE_6SUBS_01-30-2007 (PDF, 630kB) LEADFRAMES_ISPL-ASM_CuA194-AgPLATE_TR6SUBS_01-29-2007 (PDF, 47kB) LEADFRAMES_ISPL-ASM_CuA194_SDOC-NON-USE_6SUBS_01-31-2008 (PDF, 143kB) Leadframes_Mitsubishi_CCL-H_HL-830NB_832NB_830NX_832NX_ GHPL-830NB_832NB_830NX_832NX_10-JAN-2006 (PDF, 144kB) Leadframes_MITSUI_PDIP-8&14L-300MIL_SDOC-NON-USE-10SUBS_12-27-2007 (PDF, 86kB) Leadframes_NSEB_A194 (PDF, 299kB) Leadframes_NSEB_Cu-C194-Spot-Ag_Sumitomo_6subs_08-06-2007 (PDF, 254kB) Leadframes_OSE-DYNACRAFT_SPOT-Ag-CuC7025-TSSOP-TYPES_6SUBS_05-18-2007 (PDF, 193kB) LEADFRAMES_OSE-POONGSAN_ALL-TYPES_SDOC-NON-USE_PFOS_PFAS_03-19-2008 (PDF, 92kB) Leadframes_OSE-POONGSAN_CuC194-TSOC-TYPES_6SUBS_05-04-2007 (PDF, 248kB) LEADFRAMES_OSE-SAMSUNG-TECHWIN_SPOTAg-CuC194_TR6SUBS-BrCl-PFOS_02-25-2008 (PDF, 103kB) Leadframes_OSEP-SAMSUNG_CuC194-SOIC-TYPES_6SUBS_05-11-2007 (PDF, 117kB) Leadframes_Poongsan_Microtec_Corp_CuAlloy_C194_07-FEB-2007 (PDF, 116kB) Leadframes_QPL_Limited_194_NiPdAu_Plating_02-APR-2007 (PDF, 216kB) Leadframes_QPL_SDOC_7SUBS-NON-USE_01-11-2008 (PDF, 143kB) LEADFRAMES_SCS-ASM_C7025_SpotAg_6SUBS_01-29-2007 (PDF, 345kB) Leadframes_Silver Plated_C7025 (PDF, 137kB) Leadframes_Taiyo_PSR-4000_18-MAY-2006 (PDF, 94kB) Leadframes_Tatsuta_BT_Substrates_AE-1125HD_18-AUG-2006 (PDF, 254kB) Leadframes_UTL-DYNACRAFT_CuC7025-SPOT-Ag_6SUBS_05-18-2007 (PDF, 198kB) LEADFRAME_ASAT-QPL_ALL-TYPES_SDOC-NON-USE_PFOS_08-11-2007 (PDF, 75kB) LEADFRAME_ASAT-QPL_C194-AgPLATE+AE_TR6SUBS_04-02-2007 (PDF, 216kB) LEADFRAME_CARSEM-DYNACRAFT_CuC7025-SPOTAg_TR44SUBS_01-12-2007 (PDF, 462kB) Leadframe_NSEB_Cu-C194-Spot-Ag_Sumitomo_6subs_08-06-2007 (PDF, 274kB) LEADREAMES_OSE-DYNACRAFT_ALL-TYPES_SDOC-NON-USE_PFOS_PFOA_02-12-2008 (PDF, 78kB) POONGSAN (FOR AMKOR) COPPER C194 WITH SPOT SILVER PLATE "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 4, 2007 F690501/LF-CTSULP07-00777 SGS (PDF, 248kB) QPL (FOR ASAT) ALL TYPES COPPER C7025 WITH AE SURFACE TREATMENT "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 3, 2008 EC407789606 SGS (PDF, 276kB) QPL (FOR ASAT) COPPER C7025 WITH AE SURFACE TREATMENT "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Antimony (Sb), Bromine (Br), Chlorine (Cl)" April 3, 2008 EC407789606 SGS (PDF, 276kB) ICダイアタッチ部品の材料成分分析データ ABLESTIK ABLEBOND 8390A SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), PERFLUOROOCTANIC ACID ( PFOA) May 8, 2008 NA NA (PDF, 24kB) ABLESTIK ABLEBOND 8390A TEST DATA FOR PPM/WT CONTENT OF Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I) July 3, 2007 CE/2007/65666 SGS (PDF, 277kB) ABLESTIK ABLEBOND 8390A TEST DATA FOR PPM/WT CONTENT OF: Cadmium (Cd), Hexavalent Chromium (CrVI), Lead (Pb), Mercury (Hg), Polybrominated biphenyl (PBB), Polybrominated diphenyl ether (PBDE) December 12, 2007 CE/2007/C1552 SGS (PDF, 331kB) Ablestik_SDOC-NON-USE-OF_PFOS_09-04-2007 (PDF, 83kB) Ablestik_SDOC-NON-USE_PFC-PFOS-4OTHERS_FOR-8290_8200T_84-1LMISR4_12-17-2007 (PDF, 40kB) Ablestik_SDOC-NON-USE_TBBPA_ABLEBOND_14-TYPES-DIE-ATTACH_12-03-2007 (PDF, 35kB) Ablestik_SDOC_ABLEBOND_84-1LMISR4_8390A_2200D_8006NS_SbBrCl_09-26-2007 (PDF, 99kB) Die_Attaches_All_Ablestik_Products (PDF, 72kB) DIE_ATTACH_ABLEBOND-8290_BrClFI_12-12-2007 (PDF, 170kB) Die_Attach_ABLEBOND_10TYPES_SDOC-NON-USE_PFOS_11-06-2007 (PDF, 32kB) DIE_ATTACH_ABLEBOND_10TYPES_SDOC-NON-USE_PFOS_PFOA_BrClFI_07-06-2007 (PDF, 30kB) Die_Attach_ABLEBOND_15TYPES_SDOC-NON-USE_PFOS+_06-20-2007 (PDF, 45kB) Die_Attach_Ablebond_15TYPES_SDOC-NON-USE_PFOS+_TBBPA_RedP_01-28-2008 (PDF, 40kB) Die_Attach_Ablebond_16-PRODUCTS_SDOC-SUBS-NONUSE_05-07-2007 (PDF, 42kB) DIE_ATTACH_ABLEBOND_17TYPES_SDOC-NON-USE_PFOS+_02-19-2008 (PDF, 34kB) DIE_ATTACH_ABLEBOND_2000-8510AA-2300_SDOC-NON-USE_PFOS+_11-06-2007 (PDF, 37kB) DIE_ATTACH_ABLEBOND_2000_TR6SUBS_12-10-2007 (PDF, 324kB) Die_Attach_Ablebond_2025D_6subs_02-07-2007 (PDF, 228kB) Die_Attach_Ablebond_2033SC_6SUBS_11-30-2007 (PDF, 326kB) Die_Attach_ABLEBOND_2033SC_BrClFI_11-30-2007 (PDF, 306kB) Die_Attach_Ablebond_2200D_6SUBS_11-30-2007 (PDF, 185kB) Die_Attach_ABLEBOND_2200D_BrClFISb_11-30-2007 (PDF, 107kB) DIE_ATTACH_ABLEBOND_2300_TR6SUBS_12-12-2007 (PDF, 347kB) DIE_ATTACH_ABLEBOND_2600BT_TR6SUBS_12-10-2007 (PDF, 184kB) DIE_ATTACH_ABLEBOND_2600BT_TRBrClPSb_11-19-2007 (PDF, 280kB) Die_Attach_Ablebond_3230_6SUBS_12-12-2007 (PDF, 353kB) Die_Attach_ABLEBOND_7TYPES_SDOC-NON-USE_PFOS_01-11-2008 (PDF, 40kB) Die_Attach_Ablebond_8006NS_6SUBS_12-05-2007 (PDF, 341kB) Die_Attach_ABLEBOND_8006NS_BrClFI_12-05-2007 (PDF, 303kB) DIE_ATTACH_ABLEBOND_8006NS_TRBrClFI_01-10-2008 (PDF, 104kB) Die_Attach_Ablebond_8006_1-10-07 (PDF, 260kB) Die_Attach_Ablebond_8200C_6SUBS_11-30-2007 (PDF, 189kB) Die_Attach_Ablebond_8200C_84-1LMISR4_SDOC-NO-FR-USED_10-25-2007 (PDF, 36kB) Die_Attach_Ablebond_8200T_6SUBS_11-30-2007 (PDF, 185kB) Die_Attach_Ablebond_8200T_BrClFI_07-31-2007 (PDF, 106kB) Die_Attach_Ablebond_8290_6SUBS_12-12-2007 (PDF, 185kB) Die_Attach_Ablebond_8361J_6SUBS_12-10-2007 (PDF, 309kB) DIE_ATTACH_ABLEBOND_84-1LMISNB_TRBrClFI_12-03-2007 (PDF, 307kB) Die_Attach_Ablebond_84-1LMISR4_6SUBS_12-10-2007 (PDF, 185kB) DIE_ATTACH_ABLEBOND_84-1LMISR4_BrClFI_12-10-2007 (PDF, 193kB) Die_Attach_Ablebond_84-1LMISR4_ClFBrI_07-03-2007 (PDF, 284kB) Die_Attach_Ablebond_84-1LMISR4_MULTISUBS_12-03-2007 (PDF, 295kB) DIE_ATTACH_ABLEBOND_84-3J_6SUBS_12-03-2007 (PDF, 186kB) DIE_ATTACH_ABLEBOND_84-3J_BrClFI_07-03-2007 (PDF, 302kB) DIE_ATTACH_ABLEBOND_8600_6SUBS_11-30-2007 (PDF, 348kB) DIE_ATTACH_ABLEBOND_9TYPES_SDOC-NON-USE_PFOS_PFAS_02-11-2008 (PDF, 34kB) Die_Attach_ABLEBOND_9TYPES_SDOC-NON-USE_PFOS_PFOA_02-11-2008 (PDF, 31kB) DIE_ATTACH_ASAT-SUMITOMO_CRM-9TYPES_SDOC-NON-USE_PFOS_11-01-2007 (PDF, 14kB) Die_Attach_CARSEM-HENKEL_QMI-591&536_02-01-2008 (PDF, 41kB) DIE_ATTACH_CARSEM-HENKEL_QMI519_SDOC-NON-USE_BrClSb_10-31-2007 (PDF, 125kB) Die_Attach_HANA-ABLEBOND_13TYPES_SDOC-30SUBS-REPORT_02-07-2008 (PDF, 39kB) DIE_ATTACH_HANA-ABLEBOND_SDOC-NON-USE_PFOS_PFAS_09-04-2007 (PDF, 84kB) DIE_ATTACH_HENKEL_QMI2419MA_SDOC-NON-USE_PFOS+_02-19-2008 (PDF, 43kB) DIE_ATTACH_HENKEL_QMI519_TR6SUBS_07-19-2007 (PDF, 128kB) Die_Attach_Henkel_QMI529LB_6Subs_07-12-2007 (PDF, 121kB) DIE_ATTACH_HENKEL_QMI536_TR6SUBS_01-18-2008 (PDF, 837kB) DIE_ATTACH_HITACHI_EN4900-F-1_TR6SUBS_02-23-2005 (PDF, 39kB) DIE_ATTACH_OSE-HITACHI_EN4900G-TYPES_6SUBS_06-19-2007 (PDF, 161kB) DIE_ATTACH_OSE-HITACHI_EN4900G-TYPES_SDOC-NON-USE_HALOGENS_02-21-2008 (PDF, 364kB) Die_Attach_OSEP-HITACHI_EN-4900G_6SUBS_05-28-2007 (PDF, 165kB) DIE_ATTACH_SUMITOMO_CRM-1525D_TR6SUBS_12-27-2007 (PDF, 337kB) Die_Attach_Sumitomo_CRM1076E (PDF, 49kB) ICボンドワイヤ部品の材料成分分析データ BOND_WIRE_AMKOR-HERAEUS_ALLTYPES_SDOC-NON-USE_6SUBS_R03-10-2008 (PDF, 153kB) BOND_WIRE_AMKOR-HERAEUS_ALLTYPES_SDOC-NON-USE_PFOS+_R20-18-2008 (PDF, 158kB) BOND_WIRE_AMKOR-HERAEUS_AuWIRE_TR6SUBS_05-28-2007 (PDF, 588kB) Bond_Wire_AMKOR-MKE_Au-WIRE_PFOS_05-02-2007 (PDF, 105kB) Bond_Wire_AMKOR-MKE_Au-WIRE_SDOC-CONTENT-USE_8SUBS_01-14-2008 (PDF, 65kB) BOND_WIRE_AMKOR-MKE_AuWIRE-2N_TR91SUBS_01-15-2008 (PDF, 645kB) BOND_WIRE_AMKOR-MKE_AuWIRE-HTS_SDOC-NON-USE_PFOS+_10-25-2007 (PDF, 80kB) BOND_WIRE_AMKOR-TANAKA_Au-1MILGPG_SDOC-NON-USE_PFOS+_10-05-2007 (PDF, 21kB) Bond_Wire_AMKOR-TANAKA_Au-2TYPES_SDOC-NON-USE_PFOS+_01-15-2008 (PDF, 24kB) BOND_WIRE_AMKOR-TANAKA_AuWIRE_TR-BrClFISb_01-16-2008 (PDF, 139kB) BOND_WIRE_AMKOR-TANAKA_AuWIRE_TR-PFOS-PFOA_02-21-2008 (PDF, 125kB) BOND_WIRE_AMKOR-TANAKA_AuWIRE_TR-R6SUBS_01-04-2008 (PDF, 154kB) BOND_WIRE_ASAT-MKE_AuWIRE-TYPE4N_TR6SUBS_08-13-2007 (PDF, 227kB) BOND_WIRE_ASAT-MKE_AuWIRE_SDOC-NON-USE_CdHgCrVI_PBB_PBDE_PFOS_PFAS_01-18-2008 (PDF, 14kB) Bond_Wire_CARSEM-TANAKA_AU-WIRE_SDOC-NON-USE_PFOS+_02-04-2008 (PDF, 41kB) BOND_WIRE_CIRTEK-HERAEUS_Au-BOND-WIRE_6SUBS_01-22-2008 (PDF, 55kB) BOND_WIRE_ISPL-HEREAUS_AuWIRE_22SUBS_07-13-2007 (PDF, 775kB) BOND_WIRE_ISPL-TANAKA_AuWIRE_TR6SUBS_01-05-2007 (PDF, 129kB) BOND_WIRE_MKE_AuWIRE_PFOS_05-02-2007 (PDF, 105kB) Bond_Wire_OSEP-HERAEUS_AU-TYPES-HD2BE-HD5CE-HD6CA_6SUBS_01-22-2008 (PDF, 55kB) BOND_WIRE_SC-K&S_AuWIRE-RADIX-3N_TR6SUBS_10-12-2007 (PDF, 398kB) BOND_WIRE_SCS-K&S_Au-AW14_6SUBS_12-25-2007 (PDF, 415kB) BOND_WIRE_SCS-TANAKA_Au_6SUBS_01-04-2008 (PDF, 148kB) BOND_WIRE_SPIL-SUMITOMO_Au-NLF-NLF1-NLFA_TR4MET_04-04-2005 (PDF, 40kB) BOND_WIRE_SPIL-SUMITOMO_Au-NLF-NLF1-NLFA_TR4MET_04-04-2005 (PDF, 40kB) Bond_Wire_UTL-TANAKA_SDOC-NON-USE_PFOS_PFOA_06-15-2007 (PDF, 114kB) Gold_Wire_Carsem-TANAKA_ALL_TYPES_6SUBS_08-13-2007 (PDF, 187kB) Gold_Wire_HANA-TANAKA_SDOC-NON-USE_PFOS_ALL-WIRE-TYPES_R01-25-2008 (PDF, 61kB) Gold_Wire_Heraeus_Oriental_Hitec_Co._Au_Wire_02-FEB-2007 (PDF, 99kB) Gold_Wire_HEREAUS_ALL-WIRE-TYPES_SDOC-NON-USE-6SUBS_12-24-2007 (PDF, 90kB) Gold_Wire_MK_Electron_Co._4N_16-JAN-2007 (PDF, 202kB) Gold_Wire_Tanaka_4N_6SUBS_01-05-2007 (PDF, 129kB) Gold_Wire_Tanaka_ALL_TYPES_01-04-2008 (PDF, 151kB) Gold_Wire_TANAKA_ClFBrI_Sb2O3_07-17-2006 (PDF, 305kB) Gold_Wire_Tanaka_NSEB_05-JAN-2007 (PDF, 128kB) Gold_Wire_Tanaka_SDOC-NON-USE-TBBPA_ALL-GOLD-BOND-WIRE-TYPES_12-16-2007 (PDF, 157kB) Gold_Wire_Tanaka_SDOC-NON-USE_TBBP-A_12-06-2007 (PDF, 162kB) Gold_Wire_Tanaka_SGS_Labs_6-13-06 (PDF, 125kB) HERAEUS (FOR AMKOR) GOLD (Au) BOND WIRE TYPES HA3, HA5, HA6, HA9, H10 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 22, 2008 LF-CTSQYA08_01753 SGS (PDF, 55kB) ICモールド樹脂部品の材料成分分析データ ENCAP_HENKEL_FP4451_FP4549_MCL-200C_SDOC-NON-USE_PFOS_11-02-2007 (PDF, 48kB) ENCAP_NAGASE-CHEMTEX_T693-R1001_T693-R1004_SODC-CONTENT_PFOS_10-31-2007 (PDF, 40kB) ENCAP_NAGASE-CHEMTEX_T693-R1001_T693-R1004_TR11SUBS_06-29-2007 (PDF, 106kB) MOLD_COMPOUND_AMKOR-NITTO_15TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 60kB) Mold_Compound_AMKOR-NITTO_MP8000CH4A2_SDOC-NON-USE_PFOS+_01-16-2008 (PDF, 63kB) MOLD_COMPOUND_AMKOR-SUMITOMO_26TYPES_SDOC-NON-USE_4SUBS_06-18-2007 (PDF, 35kB) MOLD_COMPOUND_AMKOR-SUMITOMO_8TYPES_SDOC-NON-USE_PFOS+_01-22-2008 (PDF, 507kB) Mold_Compound_ASAT-SUMITOMO_CRN1525D_CRM1076W_EME-G700_SDOC-NON-USE_PFOS_01-22-2008 (PDF, 310kB) MOLD_COMPOUND_ASAT-SUMITOMO_EME-9TYPES_SDOC-NON-USE_PFOS_11-01-2007 (PDF, 14kB) Mold_Compound_ASAT-SUMITOMO_EME-G770C_EME-G700_SDOC-CONTENT-REPORT_09-13-2004 (PDF, 62kB) Mold_Compound_CARSEM-HITACHI_CEL-92-4TYPES_SDOC-NON-USE_PFOS_01-28-2008 (PDF, 334kB) MOLD_COMPOUND_CARSEM-HITACHI_CEL9220HF&VTYPE_SDOC-NON-USE_BrClSb_10-30-2007 (PDF, 18kB) MOLD_COMPOUND_CARSEM-NITTO_18TYPES_SDOC-NON-USE_PFOS_02-20-2008 (PDF, 216kB) Mold_Compound_CARSEM-SUMITOMO_32TYPES_SDOC-NON-USE_PFOS_01-31-2008 (PDF, 418kB) Mold_Compound_CEL_9200BC_01-JUN-2006 (PDF, 529kB) 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(PDF, 134kB) MOLD_COMPOUND_NITTO_MP8000-Aseries_6SUBS_07-20-2007 (PDF, 149kB) MOLD_COMPOUND_NITTO_MP8000-Aseries_6SUBS_07-26-2007 (PDF, 149kB) Mold_Compound_NITTO_MP8000AN_SDOC-NON-USE-6SUBS_12-21-2007 (PDF, 59kB) Mold_Compound_Nitto_MP8000A_Series_01-AUG-2006 (PDF, 125kB) Mold_Compound_Nitto_MP8000C_Series_12-MAR-2007 (PDF, 241kB) Mold_Compound_Nitto_Products (PDF, 49kB) Mold_Compound_OSE-SUMITOMO_5TYPES_SDOC-NON-USE_PFOS_PFOA_02-13-2008 (PDF, 372kB) MOLD_COMPOUND_SHINESTU_KMC-3580-P_6SUBS_05-16-2007 (PDF, 408kB) Mold_Compound_SHINESTU_KMC-385P-8_KMC-385P-14F_SDOC-REPORT-CONTENT_07-05-2007 (PDF, 464kB) Mold_Compound_SHINETSU_KMC-3580P-14F_KMC-3580P-8_SDOC-NON-USE-6SUBS_12-27-2007 (PDF, 24kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_25SUBS_05-22-2007 (PDF, 568kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_BrCl_06-15-2007 (PDF, 24kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_TBBPA_DECA-BDE_12-03-2007 (PDF, 304kB) Mold_Compound_SUMITOMO-9TYPES_SDOC-NON-USE_PFOS_R01-25-2008 (PDF, 381kB) Mold_Compound_Sumitomo_EME-6300H_6SUBS_03-27-2007 (PDF, 107kB) MOLD_COMPOUND_SUMITOMO_EME-6300H_TR6SUBS_02-20-2008 (PDF, 220kB) Mold_Compound_Sumitomo_EME-6600A_6SUBS_03-29-2006 (PDF, 128kB) MOLD_COMPOUND_SUMITOMO_EME-6600A_TR6SUBS_03-03-2008 (PDF, 454kB) MOLD_COMPOUND_SUMITOMO_EME-6600CR_6SUBS_03-21-2007 (PDF, 108kB) Mold_Compound_Sumitomo_EME-6600CS_6SUBS_08-20-2007 (PDF, 289kB) Mold_Compound_Sumitomo_EME-6600HR_6SUBS_08-13-2007 (PDF, 291kB) Mold_Compound_Sumitomo_EME-6600H_6Subs_02-26-2007 (PDF, 330kB) Mold_Compound_Sumitomo_EME-6600RA_6SUBS_07-05-2007 (PDF, 571kB) Mold_Compound_Sumitomo_EME-6710SJ_6SUBS_01-09-2007 (PDF, 558kB) Mold_Compound_Sumitomo_EME-6710S_6SUBS_07-31-2007 (PDF, 1064kB) Mold_Compound_Sumitomo_EME-6730B_6SUBS_05-07-2007 (PDF, 295kB) Mold_Compound_Sumitomo_EME-7351LS_6SUBS_06-28-2007 (PDF, 388kB) Mold_Compound_Sumitomo_EME-7730LF_6SUBS_08-27-2007 (PDF, 293kB) Mold_Compound_Sumitomo_EME-7730L_6subs_02-26-2007 (PDF, 348kB) Mold_Compound_Sumitomo_EME-7730L_EME-6300SR_EME-6650RL_EME-7720T_EME-S351TQ_and_EME-S730_11-04-2003 (PDF, 2400kB) MOLD_COMPOUND_SUMITOMO_EME-G600-TYPEC_TR6SUBS_02-05-2008 (PDF, 337kB) Mold_Compound_Sumitomo_EME-G600C_6SUBS_02-26-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G600_6SUBS_08-20-2007 (PDF, 290kB) Mold_Compound_SUMITOMO_EME-G600_BrCl_06-21-2007 (PDF, 117kB) Mold_Compound_Sumitomo_EME-G600_SbClBr_06-07-2007 (PDF, 260kB) Mold_Compound_Sumitomo_EME-G605L_6SUBS_03-23-2007 (PDF, 107kB) Mold_Compound_Sumitomo_EME-G605_SbClBr_10-20-2007 (PDF, 200kB) Mold_Compound_Sumitomo_EME-G700A_6SUBS_03-07-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G700CA_6SUBS_01-30-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G700E_6SUBS_03-12-2007 (PDF, 94kB) Mold_Compound_Sumitomo_EME-G700HA_6SUBS_08-17-2006 (PDF, 283kB) Mold_Compound_Sumitomo_EME-G700J_6SUBS_05-03-2007 (PDF, 257kB) Mold_Compound_Sumitomo_EME-G700K_6SUBS_11-07-2006 (PDF, 138kB) Mold_Compound_Sumitomo_EME-G700K_SbClBr_11-05-2007 (PDF, 246kB) Mold_Compound_Sumitomo_EME-G700L_6SUBS_08-21-2007 (PDF, 454kB) Mold_Compound_Sumitomo_EME-G700L_SbClBr_11-05-2007 (PDF, 114kB) MOLD_COMPOUND_SUMITOMO_EME-G700L_TRBrClSb_11-05-2007 (PDF, 114kB) Mold_Compound_Sumitomo_EME-G700M_6SUBS_08-13-2007 (PDF, 295kB) Mold_Compound_Sumitomo_EME-G700M_SbClBr_11-05-2007 (PDF, 114kB) Mold_Compound_Sumitomo_EME-G700_6SUBS_08-08-2007 (PDF, 387kB) Mold_Compound_Sumitomo_EME-G700_ClBr_08-22-2007 (PDF, 1667kB) Mold_Compound_Sumitomo_EME-G760_6SUBS_01-22-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G770C_6SUBS_04-02-2007 (PDF, 335kB) MOLD_COMPOUND_SUMITOMO_EME-G770C_TR6SUBS_04-02-2007 (PDF, 339kB) Mold_Compound_Sumitomo_EME-G770HCD_6SUBS_03-23-2007 (PDF, 107kB) MOLD_COMPOUND_SUMITOMO_EME-G770HCD_6SUBS_06-18-2007 (PDF, 278kB) Mold_Compound_SUMITOMO_EME-G770HCD_BrClFSb_05-28-2007 (PDF, 289kB) Mold_Compound_Sumitomo_EME-G770HCd_SbClBr_06-07-2007 (PDF, 264kB) Mold_Compound_SUMITOMO_EME-G770HCD_SbFClBr_05-28-2007 (PDF, 289kB) Mold_Compound_SUMITOMO_EME-G770HCD_SDOC-NON-USE-4SUBS_12-21-2007 (PDF, 52kB) Mold_Compound_Sumitomo_EME-G770HC_6SUBS_08-27-2007 (PDF, 292kB) Mold_Compound_Sumitomo_EME-G770H_6SUBS_05-25-2006 (PDF, 325kB) Mold_Compound_Sumitomo_EME-G770H_Type-CD_6subs_03-23-2007 (PDF, 109kB) MOLD_COMPOUND_SUMITOMO_EME-G770_TR6SUBS_10-09-2007 (PDF, 150kB) Mold_Compound_SUMITOMO_SDOC-FOR_EME-7351-TYPE-LS_BrCl_TBBPA_28SUBS_11-08-2007 (PDF, 26kB) Mold_Compound_UTL-SUMITOMO_11TYPES_SDOC-NON-USE_PFOS_PFOA_PFAS_02-12-2008 (PDF, 536kB) SHINETSU KMC184-7 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" February 25, 2008 LPCI/03475/08 SGS (PDF, 221kB) SUMITOMO EME-6300 TYPE H3L "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 8, 2008 KA/2008/40050 SGS (PDF, 476kB) SUMITOMO EME-G700 TYPE K "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" November 20, 2007 20205402C/07 (1) SGS (PDF, 155kB) SUMITOMO EME-G700 TYPE K TEST DATA FOR PPM/WT CONTENT OF: Antimony (Sb), Bromine (Br), Chlorine (Cl) November 5, 2007 ATS/GEL/697/07/sk ALS (PDF, 246kB) モールド樹脂ICP分析概要 IC表面仕上げ部品の材料成分分析データ PLATING ROHM & HAAS (FOR AMKOR) SOLDERON ST-380 ACID HC, SOLDERON ST-380 ANTI-OXIDANT, SOLDERON ST-380 PRIMARY, SOLDERON ST-380 SECONDARY, SOLDERON TIN CONCENTRATE TEST DATA FOR PPM/WT CONTENT OF: Cadmium (Cd), Hexavalent Chromium (CrVI), Lead (Pb), Mercury (Hg), Polybrominated biphenyl (PBB), Polybrominated diphenyl ether (PBDE) December 12, 2007 EC407642601 SGS (PDF, 245kB) PLATING ROHM & HAAS (FOR AMKOR) SOLDERON ST-380 ANTI-OXIDANT, SOLDERON ST-380 PRIMARY, SOLDERON ST-380 SECONDARY SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCE: Perfluorooctane sulfonates (PFOS) April 18, 2008 (PDF, 172kB) PLATING ROHM & HAAS (FOR AMKOR) SOLDERON ST-380 ANTI-OXIDANT, SOLDERON ST-380 PRIMARY, SOLDERON ST-380 SECONDARY SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony (Sb), Arsenic (As), Asbestos, Azo, Berylllium (Be), Bismuth (Bi), Bromoniated Flame Retardants other than PBB/PBDE/TBBPA, Cadmium (Cd), Chlorodiphenylmethanem Dichloroethyle, Trichloromethane, Pentachloroethane, Tetrachloromethane, Aliphatic Chlorinated Hydrocarbons (other than PCN/PCB/PCT/SCCP), Short Chain Chlorinated Paraffins (SCCP), Bromodiphenylmethane, Expanded Polystyrene (EPS), Fromaldehyde, Ugilec 121, Ugilec 141, DBBT, Halons, Chlorinated Flurocarbons, HCFC, HBFC, Carbon Tetrachloride, Hydro Fluoro Carbons, Per Fluoro Carbons, Hexavelent Chromium, Lead (Pb), Mercury (Hg), Natural rubber, Nickel (Ni), Palladium, Penta Chloro Phenol (PCP), Perfluorooctane sulfonates (PFOS), Phthalates (DEHP, DBP, DINP, DINP, DNOP, DNHP), Polybrominated Biphenyls (PBB), Polybrominated Diphenlethers (PBDE, PBDO, PBBE, DBDPE, DBDPO), Polychlorinate dBiphenyls (PCB), Polychlorinate terphenyls PCT), Polychlorinated Napthalenes (PCN) Polycyclic Aromatic Hydrocarbons (PAH), Polyvinyl Chloride (PVC), Radioactive substances, Red Phosphorus, Selenium (Se), Tetrabromo bis phenol A (TBBP-A), Tributyltin (TBT), Tributyltin Oxide (TBTO), Triphenlytin (TPT) April 4, 2008 (PDF, 194kB) Plating_ASAT-ROHM&HASS_PLATE-19ITEMS_SDOC-NON-USE_PFOS_PFOA_04-11-2007 (PDF, 233kB) PLATING_CARSEM-REDRING_Sn-SnPb-PLATING_SDOC-NON-USE_BrCl_10-08-2007 (PDF, 79kB) PLATING_CARSEM-REDRING_Sn-SnPb-PLATING_SDOC-NON-USE_PFOS_PFOA_01-30-2008 (PDF, 80kB) PLATING_CARSEM-REDRING_SnPb-ANODE_TR6SUBS_02-25-2008 (PDF, 86kB) PLATING_CIRTEK-SCHLOETTER_PURESn-PLATE_6SUBS_03-19-2007 (PDF, 679kB) PLATING_HANA-ASM_Ag-PLATE-PPF_TR6SUBS_01-23-2008 (PDF, 933kB) PLATING_ISPL-AEM_PURESn_TR6SUBS_10-04-2007 (PDF, 195kB) Plating_ISPL-TECHNIC_6-TIN-PLATE_SDOC-NON-USE_6SUBS_01-30-2008 (PDF, 116kB) PLATING_ISPL-TECHNIC_PURE-TIN_6SUBS_03-21-2007 (PDF, 204kB) PLATING_ISPL-TECHNIC_PURESnBALL_TR6SUBS_01-24-2008 (PDF, 916kB) Plating_OSE-SCHLOETTER_TIN-PLATE-6ITEMS_SDOC_NON-USE_21SUBS_01-27-2008 (PDF, 90kB) Plating_OSEP-SCHLOTER_TIN_4SUBS_01-30-2007 (PDF, 437kB) PLATING_SCHLOETTER_PLATING_ALL-TYPES_SDOC-NON-USE_PFOS_PFOA_06-2007 (PDF, 21kB) PLATING_SCS-SCHLOETTER_Sn99-99ANODE_6SUBS_03-21-2007 (PDF, 668kB) PLATING_UTL-KOKI_SnANODE_TR6SUBS_12-11-2007 (PDF, 3184kB) PLATING_UTL-KOKI_SnANODE_TR6SUBS_12-11-2007 (PDF, 3184kB) Plating_UTL-TECHWIN_SDOC-NON-USE_9SUBS_-2-12-2008 (PDF, 108kB) REDRING (FOR CARSEM) PURE TIN ANODE "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" December 31, 2007 LPCI/24763/07 SGS (PDF, 93kB) ROHM & HAAS (FOR ASAT) SOLDERON ST-380 ANTIOXIDANT FOR TIN PLATING "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 22, 2008 EC408009604 SGS (PDF, 243kB) ROHM & HAAS (FOR ASAT) SOLDERON ST-380 PRIMARY FOR TIN PLATING "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 22, 2008 EC408009602 SGS (PDF, 244kB) ROHM & HAAS (FOR ASAT) SOLDERON ST-380 SECONDARY FOR TIN PLATING "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 22, 2008 EC408009603 SGS (PDF, 243kB) Surface_Finish_ASAT_Leadfree_Solderon_ST200.pdf (PDF, 28kB) Surface_Finish_CARSEM-REDRING_ALL-TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 80kB) Surface_Finish_Carsem_Leadfree_Solder_Ball (PDF, 96kB) Surface_Finish_HANA-ULTRACORE_TINPLATE_SDOC-SUBS-DISCLOSURE_01-23-2008 (PDF, 1687kB) Surface_Finish_HANA-ULTRACORE_TIN_SDOC-NON-USE_PFOS_PFAS_06-27-2007 (PDF, 61kB) Surface_Finish_Koki_Products_Tin_Pure_Metal_05-APR-2007 (PDF, 748kB) Surface_Finish_Redring_Solder_Pure_Tin_Solder_Anode_27-MAR-2007 (PDF, 197kB) Surface_Finish_Rohm_Haas_Electronic_Materials_ST380_Solderon_Process_Solutions_14-FEB-2007 (PDF, 193kB) ICシリコンチップ部品の材料成分分析データ Silicon_Wafer_03-JULY-2007 (PDF, 118kB) 半田ボールの材料成分分析データ SOLDER_BALL_AMKOR-MKE_Sn63-Pb37BALL_SDOC-NON-USE_6SUBS_01-11-2008 (PDF, 79kB) SOLDER_BALL_AMKOR-MKE_Sn63-Pb37BALL_TR8SUBS_01-14-2008 (PDF, 302kB) SOLDER_BALL_AMKOR-MKE_Sn955-Ag4-Cu5_SDOC-NON-USE_PFOS+_10-25-2007 (PDF, 80kB) SOLDER_BALL_AMKOR-MKE_Sn955-Ag4-Cu5_TR9SUBS_01-14-2008 (PDF, 309kB) SOLDER_BALL_AMKOR-MKE_Sn985-Ag1-Cu5_TR9SUBS_01-14-2008 (PDF, 304kB) SOLDER_BALL_ASAT-MKE_96.5Sn-3.0Ag-0.5Cu_SDOC-CONTENT-8SUBS_01-18-2008 (PDF, 104kB) SOLDER_BALL_ASAT-PMTC_96.5Sn-3.0Ag-0.5Cu_SDOC-CONTENT_PFOS_01-21-2008 (PDF, 104kB) SOLDER_BALL_ASAT-SENJU_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 26kB) SOLDER_BALL_CASIO-WLCSP_BUMP_4SUBS_07-23-2007 (PDF, 73kB) SOLDER_BALL_SPIL-SENJU_Sn63Pb37-SPARKLE-BALL_TR12SUBS_03-22-2005 (PDF, 385kB) SOLDER_BALL_SPIL-SENJU_SnAgCu-ECO-M705_TR12SUBS_03-22-2005 (PDF, 397kB) SOLDER_BALL_UTL-KOKI_39TYPES-PbFREE_TR6SUBS_12-11-2007 (PDF, 3184kB) UCSP_Solder_Balls_6sub_07-20-2007 (PDF, 116kB) UCSP_SOLDER_BALLS_MAXIM-NIPPON_SUBSTANCES-CONTENT-REPORT_01-09-2008 (PDF, 830kB) 最終製品モールド樹脂データサプライヤによる危険物質の申告 Amkor社の危険物質に関する品質保証のレター (PDF, 242kB) 材料成分分析ラボのISO 17025認証 ALS_chem&bio_17025_cert (PDF, 33kB) ALS_envr_test_17025_cert (PDF, 17kB) Nippon_Micrometal_Corp (PDF, 329kB) SGS_Hong_Kong_Ltd (PDF, 119kB) SGS_Malaysia (PDF, 207kB) SGS_Taiwan_Ltd (PDF, 49kB) チップラミネーションテープの材料成分分析データ LAMINATION_TAPE_CASIO-WLCSP_6SUBS_07-23-2007 (PDF, 233kB) Maxim_Adwill_LC2850(40)_Postcure_6subs_07-06-2007 (PDF, 67kB) 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