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Flagship Process Technologies
プロセス技術
Maxim offers an unrivaled combination of proven process and package technologies. We run over 160 different integrated circuit processes—the industry's broadest range of analog and mixed-signal IC process technologies. Our products are extraordinarily reliable, achieving a failure rate of 0.49 FITs (failures per 109 device hours).
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Maxim Process Technologies
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SiGe Bipolar/BiCMOS
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Complementary Bipolar/BiCMOS
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High-Voltage BiCMOS/DMOS
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CMOS and RFCMOS
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NPN
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fT = 25GHz to 200GHz
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fT = 7GHz to 25GHz
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fT = up to GHz
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Yes
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PNP
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Vertical, lateral
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Vertical
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Vertical to 50V,
lateral to 30V
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LPNP
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CMOS
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3V, 5V
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3.3V to 5.5V
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1.8V to 220V
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1.8V/3.3V, 5V
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DMOS
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12V to 40V
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1.8V to 220V
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NMOS
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18V/36V
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PMOS
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28V
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Resistors
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Poly, NiCr, SiCr
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Implanted, Poly, NiCr, SiCr
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Poly, SiCr
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Thin film, Poly
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Capacitors
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MOS, high-Q MIM
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MOS, high-Q MIM
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MOS, MIM
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MIM
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Inductors
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High-Q
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Diodes
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2:1 varactor
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Zener
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Metal Layers
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3 to 4
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2 to 3
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3 to 4
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Multiple, Thick top
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SOI Process Available
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Yes
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Yes
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Yes
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Additional Features
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Fuse programmable
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OTP memory
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Packaging
Maxim provides more than 250 package types to meet your needs for analog performance, size, cost, and reliability. Our large selection includes wafer level packaging, hybrids/modules, flip-chip, low-cost QFN, and flip-chip on lead frame.
その他の情報
Contact Us to learn more about our flagship process technologies and packaging options.
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